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晶圆分选检测一体机
概述
Applicable Product：Devices are integrated circuit devices in die form contained on film
Product Size：8”& 12”
Tape：UV-Tape、Bule-tape
Work Mode：Wafer to Wafer(Customized)
FOV：17X17mm
Detect Area：Front/Back、Left/Right、Backside
Detect Capalitilty：≥10um
UPH ：18000/H
Position Accuracy：±30um
详情内容
Product Introduction
Description：Fully Automatic Inspection And Sorting System
Applicable Product：Devices are integrated circuit devices in die form contained on film
Product Size：8”& 12”
Tape：UV-Tape、Bule-tape
Work Mode：Wafer to Wafer(Customized)
FOV：17X17mm
Detect Area：Front/Back、Left/Right、Backside
Detect Capalitilty：≥10um
UPH ：18000/H
Position Accuracy：±30um
General Specification
|
Wafer Size |
8" & 12" |
|
Wafer Type |
V-notch/Flat |
|
Wafer Thickness |
50μm-1200μm |
|
Wafer Warpage |
2000um |
|
Minimum Die Size |
0.5x0.5mm |
|
Maximum Die Size |
20x20mm |
|
UPH |
Max 18000（based on 3X3X0.6mm die size） |
|
Tape |
UV Tape ,Bule Tape |
|
Maximum Input Cassette Capacity |
25 Frames(8”cassette），13 Frames(12”cassette） |
|
Protruding Film Frame Detection |
Optical sensor |
|
Frame Size Capability |
8“& 12”Frame Diameter |
|
Rotation Capability |
360° |
|
Programmable Expansion |
Customized |
|
Wafer Frame Warpage |
2mm |
|
Pepper Pot Type |
Customized |
|
Programmable Ejection |
Customized |
|
Turret Pick and Place |
18 x Heads |
|
Programmable Pick Force |
50-200g |
|
Pick Up Accuracy |
±10% |
|
Unit Presence Detection |
Vacumm Sensor |
|
Pre-Pick aAto Correction |
X/Y/θ（By input table） |
|
Pre-Placement Auto Correction |
X/Y/θ（By out table） |
|
Wafer Map |
Inport：txt/xlsx/dwt |
|
Outport：txt/xlsx/jpg |
|
|
Unit Theta Accuracy |
±0.5° |
|
Output Placement Accuracy |
±30um |
|
Ionizer |
YES |
|
SECS/GEM |
Optional |
Basic Specification
|
Traffic Light |
3 Color Traffic lights with dual-audio alarm |
|
MTBF |
≥168hrs |
|
MTBA |
≥120min |
|
MTTA |
≤5min |
|
MTTR |
≤20min |
|
MTTC |
30-90min |
|
Uptime |
≥98% |
|
BCR/OCR Reader |
Barcode reader, option for OCR |
|
Cleanliness |
Class 10 |
|
Dimension |
2160mm X 1775mm X 2300mm |
|
Weight |
2700KG |
|
Power |
15KW 3P 4W 50A |
|
Air |
0.7Mpa |
|
EMO |
YES |
Inspection Specification
25M Solution
|
|
Input Top Vision |
Look-up Vision |
2Side Left/Right Vision |
2Side Front/Back Vision |
Output Top Vision |
|
Camera Resolution(pixel) |
25 MP |
25 MP |
25 MP |
25 MP |
5 MP |
|
Lighting Configuration Control |
Computerized |
Computerized |
Computerized |
Computerized |
Computerized |
|
FOV Coverage(mm) |
19X19 |
17X17 |
17X17 |
17X17 |
19X19 |
|
Resolution(um/pixel) |
3.8 |
3.3 |
3.3 |
3.3 |
3.8 |
|
Die Alignment(X,Y,Theta） |
Y |
Y |
|
|
Y |
|
Surface Inspection |
Y |
Y |
Y |
Y |
Y |
|
Bump Quality |
Y |
Y |
|
|
Y |
|
Device Gap Measurement |
|
|
|
|
Y |
5M Solution
|
|
Input Top Vision |
Look-up Vision |
2Side Left/Right Vision |
2Side Front/Back Vision |
Output Top Vision |
|
Camera Resolution(pixel) |
5 MP |
5 MP |
4 MP |
4 MP |
5 MP |
|
Lighting Configuration Control |
Computerized |
Computerized |
Computerized |
Computerized |
Computerized |
|
FOV Coverage(mm) |
17X17 |
17X17 |
17X17 |
17X17 |
17X17 |
|
Resolution(um/pixel) |
8.3 |
8.3 |
8.3 |
8.3 |
8.3 |
|
Die Alignment(X,Y,Theta） |
Y |
Y |
|
|
Y |
|
Surface Inspection |
Y |
Y |
Y |
Y |
Y |
|
Bump Quality |
Y |
Y |
|
|
Y |
|
Device Gap Measurement |
|
|
|
|
Y |
Machine Layout
Machine Layout
Competitive Advantage
High Flexibility Provides multiple modes and resolutions to fit various customer requirements
Best Capability Redesign the organization according to the existing problems of competitors
Instant Service Local service will be offered to assure machine quality
High Throughtput 20% faster than competitors to enable great throughput
Price offers competitive price which is 30% lower than competitors’
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